Impingement cooling in a simulated data center servers with an array of elliptic air jets

Sheng Kai Chang, Yuan Hsiang Lo, Yao-Hsien Liu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Reducing the electricity consumption from the cooling systems in a data center can cut the energy cost. The development of the high efficiency cooling schemes can effectively save more energy from the computer room air conditioning (CRAC) system. Impingement cooling with air jets can achieve high heat transfer rates and could be used to cool local hot spots in the cabinets. A 5 × 5 jet array was designed utilizing circular and elliptic holes. The cross sectional area of the test region was 250 mm x 25 mm. The jet Reynolds numbers is 3300. Heat transfer coefficients on the target surface were investigated. Results indicated that the impingement cooling provided lower surface temperature than the traditional fan cooling.

Original languageEnglish
Title of host publicationASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791856871
DOIs
StatePublished - 1 Jan 2015
EventASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, United States
Duration: 6 Jul 20159 Jul 2015

Publication series

NameASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Conference

ConferenceASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
CountryUnited States
CitySan Francisco
Period6/07/159/07/15

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