ILP-based inter-die routing for 3D ICs

Chia Jen Chang*, Pao Jen Huang, Tai Chen Chen, Chien-Nan Liu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Scopus citations

Abstract

The 3D IC is an emerging technology. The primary emphasis on 3D-IC routing is the interface issues across dies. To handle the interface issue of connections, the inter-die routing, which uses micro bumps and two single-layer RDLs (Re-Distribution Layers) to achieve the connection between adjacent dies, is adopted. In this paper, we present an inter-die routing algorithm for 3D ICs with a pre-defined netlist. Our algorithm is based on integer linear programming (ILP) and adopts a two-stage technique of micro-bump assignment followed by non-regular RDL routing. First, the micro-bump assignment selects suitable micro-bumps for the pre-defined netlist such that no crossing problem exists inside the bounding boxes of each net. After the micro-bump assignment, the netlist is divided into two sub-netlists, one is for the upper RDL and the other is for the lower RDL. Second, the nonregular RDL routing determines minimum and non-crossing global paths for sub-netlists in the upper and lower RDLs individually. Experimental results show that our approach can obtain optimal wirelength and achieve 100% routability under reasonable CPU times.

Original languageEnglish
Title of host publication2011 16th Asia and South Pacific Design Automation Conference, ASP-DAC 2011
Pages330-335
Number of pages6
DOIs
StatePublished - 29 Mar 2011
Event2011 16th Asia and South Pacific Design Automation Conference, ASP-DAC 2011 - Yokohama, Japan
Duration: 25 Jan 201128 Jan 2011

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Conference

Conference2011 16th Asia and South Pacific Design Automation Conference, ASP-DAC 2011
CountryJapan
CityYokohama
Period25/01/1128/01/11

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  • Cite this

    Chang, C. J., Huang, P. J., Chen, T. C., & Liu, C-N. (2011). ILP-based inter-die routing for 3D ICs. In 2011 16th Asia and South Pacific Design Automation Conference, ASP-DAC 2011 (pp. 330-335). [5722209] (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC). https://doi.org/10.1109/ASPDAC.2011.5722209