Highly durable and flexible gallium-based oxide conductive-bridging random access memory

Kai Jhih Gan, Po Tsun Liu*, Ta Chun Chien, Dun Bao Ruan, Simon M. Sze

*Corresponding author for this work

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

The flexible conductive-bridging random access memory (CBRAM) device using a Cu/TiW/Ga2O3/Pt stack is fabricated on polyimide substrate with low thermal budget process. The CBRAM devices exhibit good memory-resistance characteristics, such as good memory window (>105), low operation voltage, high endurance (>1.4 × 102 cycles), and large retention memory window (>105). The temperature coefficient of resistance in the filament confirms that the conduction mechanism observed in the Ga2O3 layer is similar with the phenomenon of electrochemical metallization (ECM). Moreover, the performance of CBRAM device will not be impacted during the flexibility test. Considering the excellent performance of the CBRAM device fabricated by low-temperature process, it may provide a promising potential for the applications of flexible integrated electronic circuits.

Original languageEnglish
Article number14141
JournalScientific reports
Volume9
Issue number1
DOIs
StatePublished - 1 Dec 2019

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