Gold-indium metal bonding method was used in this study to increase the product yield of vertical light emitting diodes (LEDs) during laser lift-off (LLO) process. The vertical GaN LED transferred onto Si substrate presented good electrical and optical properties due to the existence of high reflective mirror and texture surface. The chip size and dominant wavelength for vertical type LED are 40×40 mil2 and 450 nm. The optimal conditions of temperature and pressure for 2-inch wafer bonding are set of 200°C and 100 kg/inch2, respectively. The products yield of light output power, forward voltage and leakage current are 96 %, 96.4% and 61.2%, respectively. After aging test, the characteristics decay of light output power, forward voltage and leakage current are less than 4%. Summarization of optical and electrical properties, the total yield of these LEDs products is about 60 %.