High Transmittance Broadband THz Polarizer Using 3D-IC Technologies

Nai Chen Chi, Ting Yang Yu, Hsin Cheng Tsai, Shiang Yu Wang, Chih-Wei Luo, Yu Tao Yang, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations


A novel method of fabricating high transmittance and broadband terahertz (THz) polarizers is introduced with several advantages. A polarizer with an approximate 100% transmittance is demonstrated with single central frequency of anti-reflection (AR) layers between 0.5 THz and 2 THz. Broadband polarizer, which has a transmission spectrum of over 70% uniformity, is fabricated by bonding two wafers with different AR layers. The bandwidth of broadband THz polarizer exceeds 1 THz. Extinction ratio of the polarizer is about 30 dB depending on the frequency and Cu wire pitch. The high transmittance and broadband THz polarizer can be achieved through deep reactiveion etching (DRIE) and wafer bonding. This new fabricating method of THz polarizers has advantages of lower cost, no accurate alignment requirement and robust structure. Therefore, this approach can possibly benefit the mass production of THz optical components in THz applications and even more.

Original languageEnglish
Title of host publicationProceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages6
ISBN (Electronic)9781509043323
StatePublished - 1 Aug 2017
Event67th IEEE Electronic Components and Technology Conference, ECTC 2017 - Lake Buena Vista, United States
Duration: 30 May 20172 Jun 2017

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503


Conference67th IEEE Electronic Components and Technology Conference, ECTC 2017
CountryUnited States
CityLake Buena Vista


  • 3D-IC
  • DRIE
  • THz
  • Wafer bonding
  • Wire-grid polarizer

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