High transmittance and broaden bandwidth through the morphology of anti-relfective layers on THz polarizer with Si substrate

Nai Chen Chi, Ting Yang Yu, Hsin Cheng Tsai, Shiang Yu Wang, Chih-Wei Luo, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

To improve the transmittance of THz component and overcome the difficulties of fragile structure as well as ensuring precise alignment of existing methods, a new method involving the mature 3DIC through-silicon via (TSV) technology has been proposed to make anti-reflection layer with suitable effective refractive index based on the robustness of Si wafer. Cu wire-grid polarizers were also fabricated on wafer. The THz polarizers were completed after wafer bonding with Cu sealing ring and In/Sn guard ring. Not only the new method is easier for production with better performance, but also the silicon substrate has several advantages. The novel method has proven that THz optical component could be constructed with a nearly 100% transmittance, or widened the transmittance spectrum range from 0.5 to 2 THz when transmittances is sacrificed to 70% instead of a near 100%. Furthermore, a robust structure could also be expected with broadband transmission and excellent extinction ratio. It is properly optimized for mass production because the fabrication method could be easily done and does not required high cost.

Original languageEnglish
Title of host publicationIntegrated Optics
Subtitle of host publicationPhysics and Simulations III
EditorsJiri Ctyroky, Inigo Molina-Fernandez, Pavel Cheben
PublisherSPIE
ISBN (Electronic)9781510609853
DOIs
StatePublished - 1 Jan 2017
EventIntegrated Optics: Physics and Simulations III 2017 - Prague, Czech Republic
Duration: 24 Apr 201725 Apr 2017

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume10242
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceIntegrated Optics: Physics and Simulations III 2017
CountryCzech Republic
CityPrague
Period24/04/1725/04/17

Keywords

  • DRIE
  • THz Polarizer
  • wafer bonding
  • wire-grid

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