High thermal dissipation apparatus for UV LEDs application

Ray-Hua Horng*, Hung Lieh Hu, Re Ching Lin, Yi Chen Chiang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, composite electroplating technique is used to fabricate the diamond-added copper heat spreader for UV LED applications. Thermal dissipation characteristic and optical performance are improved as the composite diamond-added copper heat spreader adoption. The low thermal resistance of 18.4 K/W with UV LED using diamond-added copper heat spreader was measured. Surface temperature of UV LED using the diamond-added copper heat spreader is 50.42 °C at 500 mA injecting current lower than pure copper heat spreader of 59.9 °C and original heat spreader of 90.4 °C. The thermal diffusivity of the diamond-added copper is 0.7179 cm2/s measurement by laser flash method Output power and power efficiency of UV LEDs are also enhanced to 71.81 mW and 4.32 %, respectively, at 400 mA injection current. The optimal structure design and materials fabrication will be discussed.

Original languageEnglish
Title of host publicationWide Bandgap Semiconductor Materials and Devices 12
Pages35-39
Number of pages5
Edition6
DOIs
StatePublished - 1 Aug 2011
EventWide Bandgap Semiconductor Materials and Devices 12 - 219th ECS Meeting - Montreal, QC, Canada
Duration: 1 May 20116 May 2011

Publication series

NameECS Transactions
Number6
Volume35
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceWide Bandgap Semiconductor Materials and Devices 12 - 219th ECS Meeting
CountryCanada
CityMontreal, QC
Period1/05/116/05/11

Keywords

  • Composite electroplating
  • Copper-diamond sheet
  • Heat dissipation
  • Thermal resistance
  • UV LED

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  • Cite this

    Horng, R-H., Hu, H. L., Lin, R. C., & Chiang, Y. C. (2011). High thermal dissipation apparatus for UV LEDs application. In Wide Bandgap Semiconductor Materials and Devices 12 (6 ed., pp. 35-39). (ECS Transactions; Vol. 35, No. 6). https://doi.org/10.1149/1.3570843