High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices

Chung Hsuan Wang; Cho Lun Hsu; Wen Cheng Chiu; Tung Yen Lai; Tong Huan Chou; Ivy Yang; Chiahua Ho; Chen-Ming Hu; Fu Liang Yang; Y. C. Chou

doi:10.1109/MEMSYS.2013.6474389

High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices

Chung Hsuan Wang, Cho Lun Hsu, Wen Cheng Chiu, Tung Yen Lai, Tong Huan Chou, Ivy Yang, Chiahua Ho^*, Chen-Ming Hu, Fu Liang Yang, Y. C. Chou

^*Corresponding author for this work

International College of Semiconductor Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The highest reported sensitivity (35%) of DNA sieving by entropic trapping has been achieved with a low operation voltage of 8V, and short time of 6 minutes. Wafer scale fabrication of 3D artificial nano-channel matrices is based on proven NEMS, MEMS, and Through-Si-Via (TSV) semiconductor technologies and offers high potential for application in portable bioelectronic instruments. A mechanism based on entropic trapping is proposed for the observed high DNA sieving sensitivity by 3D artificial nano-channel matrices.

Original language	English
Title of host publication	IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Pages	899-902
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2013.6474389
State	Published - 2 Apr 2013
Event	IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan Duration: 20 Jan 2013 → 24 Jan 2013

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Country	Taiwan
City	Taipei
Period	20/01/13 → 24/01/13

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10.1109/MEMSYS.2013.6474389

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Wang, C. H., Hsu, C. L., Chiu, W. C., Lai, T. Y., Chou, T. H., Yang, I., Ho, C., Hu, C-M., Yang, F. L., & Chou, Y. C. (2013). High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices. In IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 (pp. 899-902). [6474389] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2013.6474389

Wang, Chung Hsuan ; Hsu, Cho Lun ; Chiu, Wen Cheng ; Lai, Tung Yen ; Chou, Tong Huan ; Yang, Ivy ; Ho, Chiahua ; Hu, Chen-Ming ; Yang, Fu Liang ; Chou, Y. C. / High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices. IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013. 2013. pp. 899-902 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{44f2942165cc4d7ea1ecfd127360effc,

title = "High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices",

abstract = "The highest reported sensitivity (35%) of DNA sieving by entropic trapping has been achieved with a low operation voltage of 8V, and short time of 6 minutes. Wafer scale fabrication of 3D artificial nano-channel matrices is based on proven NEMS, MEMS, and Through-Si-Via (TSV) semiconductor technologies and offers high potential for application in portable bioelectronic instruments. A mechanism based on entropic trapping is proposed for the observed high DNA sieving sensitivity by 3D artificial nano-channel matrices.",

author = "Wang, {Chung Hsuan} and Hsu, {Cho Lun} and Chiu, {Wen Cheng} and Lai, {Tung Yen} and Chou, {Tong Huan} and Ivy Yang and Chiahua Ho and Chen-Ming Hu and Yang, {Fu Liang} and Chou, {Y. C.}",

year = "2013",

month = apr,

day = "2",

doi = "10.1109/MEMSYS.2013.6474389",

language = "English",

isbn = "9781467356558",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "899--902",

booktitle = "IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013",

note = "null ; Conference date: 20-01-2013 Through 24-01-2013",

}

Wang, CH, Hsu, CL, Chiu, WC, Lai, TY, Chou, TH, Yang, I, Ho, C, Hu, C-M, Yang, FL & Chou, YC 2013, High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices. in IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013., 6474389, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 899-902, IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013, Taipei, Taiwan, 20/01/13. https://doi.org/10.1109/MEMSYS.2013.6474389

High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices. / Wang, Chung Hsuan; Hsu, Cho Lun; Chiu, Wen Cheng; Lai, Tung Yen; Chou, Tong Huan; Yang, Ivy; Ho, Chiahua; Hu, Chen-Ming; Yang, Fu Liang; Chou, Y. C.

IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013. 2013. p. 899-902 6474389 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices

AU - Wang, Chung Hsuan

AU - Hsu, Cho Lun

AU - Chiu, Wen Cheng

AU - Lai, Tung Yen

AU - Chou, Tong Huan

AU - Yang, Ivy

AU - Ho, Chiahua

AU - Hu, Chen-Ming

AU - Yang, Fu Liang

AU - Chou, Y. C.

PY - 2013/4/2

Y1 - 2013/4/2

N2 - The highest reported sensitivity (35%) of DNA sieving by entropic trapping has been achieved with a low operation voltage of 8V, and short time of 6 minutes. Wafer scale fabrication of 3D artificial nano-channel matrices is based on proven NEMS, MEMS, and Through-Si-Via (TSV) semiconductor technologies and offers high potential for application in portable bioelectronic instruments. A mechanism based on entropic trapping is proposed for the observed high DNA sieving sensitivity by 3D artificial nano-channel matrices.

AB - The highest reported sensitivity (35%) of DNA sieving by entropic trapping has been achieved with a low operation voltage of 8V, and short time of 6 minutes. Wafer scale fabrication of 3D artificial nano-channel matrices is based on proven NEMS, MEMS, and Through-Si-Via (TSV) semiconductor technologies and offers high potential for application in portable bioelectronic instruments. A mechanism based on entropic trapping is proposed for the observed high DNA sieving sensitivity by 3D artificial nano-channel matrices.

UR - http://www.scopus.com/inward/record.url?scp=84875455987&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2013.6474389

DO - 10.1109/MEMSYS.2013.6474389

M3 - Conference contribution

AN - SCOPUS:84875455987

SN - 9781467356558

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 899

EP - 902

BT - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013

Y2 - 20 January 2013 through 24 January 2013

ER -

Wang CH, Hsu CL, Chiu WC, Lai TY, Chou TH, Yang I et al. High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices. In IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013. 2013. p. 899-902. 6474389. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2013.6474389

High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices

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