High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices

Chung Hsuan Wang, Cho Lun Hsu, Wen Cheng Chiu, Tung Yen Lai, Tong Huan Chou, Ivy Yang, Chiahua Ho*, Chen-Ming Hu, Fu Liang Yang, Y. C. Chou

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The highest reported sensitivity (35%) of DNA sieving by entropic trapping has been achieved with a low operation voltage of 8V, and short time of 6 minutes. Wafer scale fabrication of 3D artificial nano-channel matrices is based on proven NEMS, MEMS, and Through-Si-Via (TSV) semiconductor technologies and offers high potential for application in portable bioelectronic instruments. A mechanism based on entropic trapping is proposed for the observed high DNA sieving sensitivity by 3D artificial nano-channel matrices.

Original languageEnglish
Title of host publicationIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Pages899-902
Number of pages4
DOIs
StatePublished - 2 Apr 2013
EventIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan
Duration: 20 Jan 201324 Jan 2013

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

ConferenceIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
CountryTaiwan
CityTaipei
Period20/01/1324/01/13

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