High-sensitivity CMUT with interlayer metal architecture for medical ultrasonic systems

Teng Chuan Cheng, Yu-Te Liao, Tsung Heng Tsai

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

This paper presents an integration of the capacitive micromachined ultrasonic transducers (CMUTs) and the transimpedance amplifier in medical ultrasound systems. The proposed CMUT and the sensing circuits are both fabricated on the same chip in a 0.18μm CMOS MEMS technology. Two interlayer metal structures are proposed to improve the sensitivity. The CMUTs are designed with 2MHz cells for medical diagnosis. The conversion efficiency of the CMUTs is 4 times and 1.8 times higher than that in the published structures.

Original languageEnglish
Title of host publication2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1211-1214
Number of pages4
ISBN (Electronic)9781479989553
DOIs
StatePublished - 21 Jun 2015
Event18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, United States
Duration: 21 Jun 201525 Jun 2015

Publication series

Name2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015

Conference

Conference18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
CountryUnited States
CityAnchorage
Period21/06/1525/06/15

Keywords

  • CMUT
  • TIA
  • transducer
  • ultrasonic sensor

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