Abstract
In this work, we developed a novel Hf-based gate dielectric for MOSFETs with TaN metal gate. By incorporating Ta into HfO 2 films, significant improvements were achieved in contrast to pure HfO 2: (1) the dielectric crystallization temperature is increased up to 1000°C; (2) interface states density (D it) is reduced by one order of magnitude; (3) electron peak mobility is enhanced by more than two times; (4) charge trapping and threshold voltage shift is reduced by 20 times, greatly prolonging the device lifetime; (5) negligible sub-threshold swing and G m variations under constant voltage stress (CVS).
Original language | English |
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Pages (from-to) | 110-111 |
Number of pages | 2 |
Journal | Digest of Technical Papers - Symposium on VLSI Technology |
State | Published - 1 Oct 2004 |
Event | 2004 Symposium on VLSI Technology - Digest of Technical Papers - Honolulu, HI, United States Duration: 15 Jun 2004 → 17 Jun 2004 |