High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes

Che Hsuan Huang, Kuo Ju Chen, Ming Ta Tsai, Min Hsiung Shih, Chia-Wei Sun, Wei-I Lee, Chien-Chung Lin, Hao-Chung Kuo*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

This article presents a chip-scale package (CSP) with conformal and uniform structures for white light-emitting diodes used in lighting and backlight unit (BLU) applications. The CSP structures produce higher light extraction efficiency and lower assembly-dependent packaging compared with conventional surface-mounted devices (SMDs). Simulation results show that compared with SMDs, the luminous efficiency of CSP structures is 8.81% higher in lighting applications and 9.43% higher in BLU applications. This is likely due to light loss in the light bowl of the SMDs. Moreover, CSPs with a conformal phosphor structure exhibit low assembly dependence and redundancy, and rb-CSPs with a conformal structure are a more effective light source in both lighting and BLU applications.

Original languageEnglish
Article number14087SS
Number of pages1
JournalJournal of Photonics for Energy
Volume5
Issue number1
DOIs
StatePublished - 21 Apr 2015

Keywords

  • backlight unit
  • chip-scale
  • light-emitting diode
  • lighting
  • phosphor

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