Heterogeneous chip integration process for flexible wireless microsystem application

Tzu Yuan Chao*, Chia Wei Liang, Yu-Ting Cheng, Chien-Nan Kuo

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

This paper presents a low-cost heterogeneous integration technology combining the previously developed bumpless radio-frequency (RF) system-on-a-package scheme with a special surface cleaning process to assemble a complementary metal-oxide-semiconductor chip with an organic substrate (SU-8/ polydimethylsiloxane) by low-temperature AuAu thermocompressive bonds (< 200 °C) for flexible wireless microsystem fabrication. The RF performance of -15 dB return loss and -0.25 dB insertion loss at 40 GHz and above 6 MPa bonding strength of a microstrip-to-coplanar-waveguide interconnect transition between the chip and the substrate make the technology practical for flexible wireless microsystem integration.

Original languageEnglish
Article number5699352
Pages (from-to)906-909
Number of pages4
JournalIEEE Transactions on Electron Devices
Volume58
Issue number3
DOIs
StatePublished - 1 Mar 2011

Keywords

  • AuAu thermocompressive (TC) bonding
  • bumpless interconnecting
  • flexible electronics
  • flip-chip
  • heterogeneous chip integration
  • surface cleaning

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