Grain growth in electroplated (1 1 1)-oriented nanotwinned Cu

Yi Sa Huang, Chien Min Liu, Wei Lan Chiu, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

22 Scopus citations

Abstract

The grain growth of pulse-plated (1 1 1)-oriented nanotwinned Cu (nt-Cu) was investigated at 200-350 °C. The results indicate that after the annealing, the nt-Cu exhibits good thermal stability, and columnar grains with a (1 1 1)-oriented nt-Cu structure are maintained up to 300 °C. The columnar grains consume the original fine-grained region at the bottom of the sample. In addition, these fine grains were converted into nanotwinned columnar grains with a (1 1 1) orientation. The electroplated Cu film possessed extremely high (1 1 1) preferred orientation after the annealing.

Original languageEnglish
Pages (from-to)5-8
Number of pages4
JournalScripta Materialia
Volume89
DOIs
StatePublished - 15 Oct 2014

Keywords

  • Electroplated Cu
  • Grain growth
  • Nanotwinned Cu
  • Preferred orientation

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