Electron beam evaporated Ni thin films are found to have tensile stress of 1.2 Gpa. The stress is relieved upon heating, accompanied by grain growth. The calculated stress matches the experimental result and a mechanism of grain growth is proposed.
|Number of pages||7|
|Journal||Materials Research Society Symposium - Proceedings|
|State||Published - 1 Dec 1998|
|Event||Proceedings of the 1998 MRS Spring Meeting - San Francisco, CA, USA|
Duration: 13 Apr 1998 → 16 Apr 1998