Grain growth by DIGM in Ni thin film under high tensile stress

Zhengyi Jia*, G. Z. Pan, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalConference article

Abstract

Electron beam evaporated Ni thin films are found to have tensile stress of 1.2 Gpa. The stress is relieved upon heating, accompanied by grain growth. The calculated stress matches the experimental result and a mechanism of grain growth is proposed.

Original languageEnglish
Pages (from-to)95-101
Number of pages7
JournalMaterials Research Society Symposium - Proceedings
Volume516
StatePublished - 1 Dec 1998
EventProceedings of the 1998 MRS Spring Meeting - San Francisco, CA, USA
Duration: 13 Apr 199816 Apr 1998

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