MOSFET gate oxide scaling limits are examined with respect to time-dependent breakdown, defects, plasma process damage, mobility degradation, poly-gate depletion, inversion layer thickness, tunneling leakage, charge trapping, and gate delay. It is projected that the operating field will stay around 5MV/cm for reliability and optimum speed. Tunneling leakage prevents scaling below 2nm, which is sufficient for MOSFET scaling to 0.05μm.
|Number of pages||4|
|Journal||Technical Digest - International Electron Devices Meeting|
|State||Published - 1 Dec 1996|
|Event||Proceedings of the 1996 IEEE International Electron Devices Meeting - San Francisco, CA, USA|
Duration: 8 Dec 1996 → 11 Dec 1996