Gate length scaling and threshold voltage control of double-gate MOSFETs

L. Chang*, S. Tang, T. J. King, J. Bokor, Chen-Ming Hu

*Corresponding author for this work

Research output: Contribution to journalConference article

126 Scopus citations

Abstract

In the nanoscale regime, the double-gate MOSFET can provide superior short-channel behavior. For this structure, device scaling issues are explored. Gate length scaling will be limited by the ability to control off-state leakage current due to quantum tunneling and thermionic emission between the source and drain as well as band-to-band tunneling between the body and drain. Lateral S/D doping abruptness requirements for gate length scaling are examined. VT control will be challenging as a single gate material for both NMOS and PMOS devices cannot provide low yet symmetrical VT's. CMOS integration will thus require dual gate workfunction tuning, channel doping, or asymmetrical double-gates to adjust VT. Advantages of using alternative channel materials to facilitate scaling are investigated.

Original languageEnglish
Pages (from-to)719-722
Number of pages4
JournalTechnical Digest - International Electron Devices Meeting
DOIs
StatePublished - 1 Dec 2000
Event2000 IEEE International Electron Devices Meeting - San Francisco, CA, United States
Duration: 10 Dec 200013 Dec 2000

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