Frequency responses of on-chip pressure sensor with different deformation chambers

Chia-Hung Tsai, Makoto Kaneko

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The frequency responses of a previously proposed on-chip pressure sensor is investigated with two different sizes of deformation chamber. Pressure inputs with the same span of frequencies, from 1 Hz to 64 Hz, are applied to the fabricated pressure sensors, and the pressure sensed by the on-chip sensor is represented by the movement of microbeads inside the sensing area. We found that the sensor with a larger deformation chamber leads to a greater microbeads movement where the peak-to-peak distance is around 50 μm while the one with a smaller chamber is less than 10 μm. Thus, it is concluded that a larger deformation chamber gives a better pressure resolution.

Original languageEnglish
Title of host publication2015 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479966783
DOIs
StatePublished - 21 Mar 2016
EventInternational Symposium on Micro-NanoMechatronics and Human Science, MHS 2015 - Nagoya, Japan
Duration: 23 Nov 201525 Nov 2015

Publication series

Name2015 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2015

Conference

ConferenceInternational Symposium on Micro-NanoMechatronics and Human Science, MHS 2015
CountryJapan
CityNagoya
Period23/11/1525/11/15

Fingerprint Dive into the research topics of 'Frequency responses of on-chip pressure sensor with different deformation chambers'. Together they form a unique fingerprint.

  • Cite this

    Tsai, C-H., & Kaneko, M. (2016). Frequency responses of on-chip pressure sensor with different deformation chambers. In 2015 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2015 [7438310] (2015 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MHS.2015.7438310