Forming-free resistive switching behaviors in Cr-embedded Ga 2O 3 thin film memories

Dai Ying Lee*, Tseung-Yuen Tseng

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

36 Scopus citations

Abstract

Resistive switching behaviors are studied for the rapid thermal annealing (RTA) Ga 2O 3 thin film embedding a Cr metal layer. By modifying the thickness, area, and RTA temperature of the device, the thermal-induced resistive switching is similar to those induced by the electrical forming process. The conducting filaments composed of oxygen vacancies are created by the Cr diffusion and oxidization during RTA. The related carrier conduction mechanism obeys space charge limited conduction theory accompanied by the formation/rupture of the conducting filaments at the interface between Ti and Cr:Ga 2O 3 film. This study demonstrates a convenient process to fabricate forming-free resistive switching memory devices.

Original languageEnglish
Article number114117
JournalJournal of Applied Physics
Volume110
Issue number11
DOIs
StatePublished - 1 Dec 2011

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