Formation of TiSi2 on nitrogen ion implanted (001)Si

S. L. Cheng*, L. J. Chen, Bing-Yue Tsui

*Corresponding author for this work

Research output: Contribution to journalArticle

2 Scopus citations

Abstract

Formation of TiSi2 on nitrogen ion implanted (001)Si has been investigated. Nitrogen ion implantation was found to suppress the B and As diffusion in silicon. For Ti on 30 keV BF2+-20 keV N2+ and 30 keV As+-20 keV N2+ implanted samples, a continuous low-resistivity TiSi2 layer was found to form in all samples annealed at 700-900 °C. For Ti on 1 × 1015/cm2 N2+- and As+ implanted samples, end-of-range defects were completely eliminated in all samples annealed at 700-900 °C. The results indicated that with appropriate control, N+-implantation can be successfully implemented in forming low-resistivity TiSi2 contacts on shallow junctions in deep submicron devices.

Original languageEnglish
Pages (from-to)213-221
Number of pages9
JournalJournal of Materials Research
Volume14
Issue number1
DOIs
StatePublished - 1 Jan 1999

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