Formation of Sn-rich phases via the decomposition of Cu6Sn 5 compounds during current stressing

C. K. Lin, Chien Ming Liu, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

This study examined the formation of Sn-rich phases in the matrix of Cu-Sn-Ni intermetallic compounds (IMCs) after current stressing of 1.2×104 A/cm2 at 160 °C. The Sn-rich phases were formed at the cathode end of the solder joints with Cu metallization, and this formation was attributed to the decomposition of Cu6Sn5 IMCs. When the Cu6Sn5 IMCs were transformed into Cu 3Sn during current stressing, Sn atoms were released. When the supply of Cu atoms became deficient, Sn atoms accumulated to form Sn-rich phases among the Cu-Sn-Ni IMCs.

Original languageEnglish
Pages (from-to)261-263
Number of pages3
JournalMaterials Letters
Volume124
DOIs
StatePublished - 1 Jun 2014

Keywords

  • Electromigration
  • Intermetallic compound
  • Metallic composites
  • Phase transformation
  • Solder

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