Formation of shallow p+n junctions by implanting BF2- ions into thin cobalt films on silicon substrates

M. H. Juang*, Huang-Chung Cheng

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

13 Scopus citations

Abstract

Silicided shallow p+n junctions have been formed by implanting BF2+ ions into a-Si/Co bilayer films on Si substrates and subsequent drive-in/silicidation. The effects of implantation dose and energy on the electrical characteristics were studied. The modulation ranges of implantation energy and dose employed to form good junctions are large for the present fabrication scheme. However, high-performance silicided shallow junctions must be optimized by using moderate implant energy and dosage. The junction depth, drive-in efficiency, dopant concentration and electrical characteristics must be compromised to achieve the goal of good shallow junctions. A silicided shallow junction formed by the implantation of 70 keV at a dose of 5 × 1015 cm-2 and subsequently annealed at 700°C exhibited characteristics with a leakage current density lower than 0.5 nA cm-2, a forward ideality factor better than 1.01 and a junction depth of about 0.13 μm.

Original languageEnglish
Pages (from-to)453-457
Number of pages5
JournalSolid State Electronics
Volume35
Issue number4
DOIs
StatePublished - 1 Jan 1992

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