Flip-chip packaging of In 0.6Ga 0.4As MHEMT device on low-cost organic substrate for W-band applications

Wee Chin Lim*, Chin Te Wang, Chien I. Kuo, Li Han Hsu, Szu Ping Tsai, Edward Yi Chang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Fingerprint Dive into the research topics of 'Flip-chip packaging of In <sub>0.6</sub>Ga <sub>0.4</sub>As MHEMT device on low-cost organic substrate for W-band applications'. Together they form a unique fingerprint.

Engineering & Materials Science