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Flip-chip packaging of In 0.6Ga 0.4As MHEMT device on low-cost organic substrate for W-band applications
Wee Chin Lim*, Chin Te Wang, Chien I. Kuo, Li Han Hsu, Szu Ping Tsai, Edward Yi Chang
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review