Finite-element modeling of stress distribution and migration in interconnecting studs of a three-dimensional multilevel device structure

L. T. Shi*, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

33 Scopus citations

Fingerprint Dive into the research topics of 'Finite-element modeling of stress distribution and migration in interconnecting studs of a three-dimensional multilevel device structure'. Together they form a unique fingerprint.

Physics & Astronomy