Finite element analysis of ultrasonic vibration-assisted microstructure hot glass embossing process

Lan Phuong Nguyen*, Ming Hui Wu, Ching-Hua Hung

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

Hot glass embossing is a novel technology to manufacture microtips for Field Emission Displays with high quality and low cost. This technology recently has been assisted by ultrasonic vibration. Previous studies showed that high energy of ultrasonic vibration would lead to the temperature rise inside the glass so that micro-formability of glass material has been especially improved efficiently. However, these findings were experimental only. Therefore, this work is aimed to utilise the proposed model in the previous study to analyse the shape of pyramid structures on K-PSK100 optical glass substrate during ultrasonic vibration-assisted hot glass embossing process. Microstructure hot embossing experiments were first conducted without and with the assistance of ultrasonic vibration (frequency of 35 kHz and amplitude of 3 μm). Three-dimensional simulations were then performed to predict the height of pyramids after hot embossing process. The consistency between simulations and experiments not only proved that ultrasonic vibration could increase the filling ability of glass material into microcavities up to 17% but also indicated the value of the proposed model in predicting the final shape of microstructures after ultrasonic vibration-assisted hot glass embossing process.

Original languageEnglish
Pages (from-to)199-208
Number of pages10
JournalAustralian Journal of Mechanical Engineering
Volume17
Issue number3
DOIs
StatePublished - 1 Jan 2019

Keywords

  • Ultrasonic vibration
  • finite element analysis
  • hot glass embossing
  • microstructures
  • pyramid array

Fingerprint Dive into the research topics of 'Finite element analysis of ultrasonic vibration-assisted microstructure hot glass embossing process'. Together they form a unique fingerprint.

Cite this