Fine pitch "NCF-type compliant-bumped COG"

Chao Chyun An*, Shyh Ming Chang, Ming Yao Chen, Kuo Shu Kao, Jimmy Tsang, Sheng Shu Yang, Chih Chen, Chung Kuang Lin, Ren-Haw Chen, Wen Chih Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

Non-Conductive-Film (NCF) type of Chip-on-Glass (COG) bonding method ensures the micro-order direct bonding between the IC electrode and glass substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the glass substrate. The mathematical calculation results of bump stress and bump deformation are used to identify the environmental temperature range for the given COG bonding structure. Both of the calculation and experimental results demonstrate the feasibility of using the compliant bumps to achieve a high compressive stress, high bump deformation and low as well as stable connection resistance at various environmental temperatures. The 1,000 hrs 85°C/85%RH reliability test result will be indicated.

Original languageEnglish
Title of host publicationProceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT
Pages14-17
Number of pages4
DOIs
StatePublished - 1 Dec 2007
Event2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT - Taipei, Taiwan
Duration: 1 Oct 20073 Oct 2007

Publication series

NameProceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

Conference

Conference2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT
CountryTaiwan
CityTaipei
Period1/10/073/10/07

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