FILM STRESS IN Pd//2Si LAYERS OF VARYING THICKNESS.

Betty Coulman*, H. D. Chen, Kenneth Ritz

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Little is known about the development of film stresses in very thin films (thicknesses of the order of a few hundred Angstroms or less). As interest intensifies in the technological application of ever smaller quantities of materials, the behavior of very thin films will undergo increasing scrutiny. In this study, the film stresses in evaporated Pd films and Pd//2Si films formed by reaction with the Si substrates at 250 degree C were measured for thicknesses ranging from 7 to 107 nm. Stresses were calculated from the substrate radii of curvature determined by X-ray diffraction topography techniques (Lang and double crystal) and Stoney's equation. Because film continuity cannot be taken for granted at low coverage, the films were examined by electron microscopy in an attempt to correlate their morphology with the observed stresses.

Original languageEnglish
Title of host publicationMaterials Research Society Symposia Proceedings
EditorsCarolyn Rubin Aita, K.S. SreeHarsha
PublisherMaterials Research Soc
Pages155-159
Number of pages5
ISBN (Print)093183712X
DOIs
StatePublished - 1 Dec 1985

Publication series

NameMaterials Research Society Symposia Proceedings
Volume47
ISSN (Print)0272-9172

Fingerprint Dive into the research topics of 'FILM STRESS IN Pd//2Si LAYERS OF VARYING THICKNESS.'. Together they form a unique fingerprint.

  • Cite this

    Coulman, B., Chen, H. D., & Ritz, K. (1985). FILM STRESS IN Pd//2Si LAYERS OF VARYING THICKNESS. In C. R. Aita, & K. S. SreeHarsha (Eds.), Materials Research Society Symposia Proceedings (pp. 155-159). (Materials Research Society Symposia Proceedings; Vol. 47). Materials Research Soc. https://doi.org/10.1557/PROC-47-155