Fast phase transformation due to electromigration of 18 μm microbumps in three-dimensional integrated-circuit integration

Y. W. Chang, Chih Chen*, T. C. Chang, C. J. Zhan, J. Y. Juang, Annie T. Huang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

The electromigration behavior was investigated in 18-μm SnAg microbumps at 150 °C. The monitored resistance increase abruptly soon after the current stressing of 4.6×104 A/cm2 was applied but the resistance rose much slower after a certain period of time. The formation of the high-resistivity Ni3Sn4 intermetallic compounds (IMCs) was responsible for the abrupt resistance increase in the beginning of the current stressing. The whole solder joint was transformed into an IMC joint. Because IMC has a higher electromigration resistance than the solder, a much slower increase in resistance was resulted after the solder joint was transformed into IMCs.

Original languageEnglish
Pages (from-to)136-138
Number of pages3
JournalMaterials Letters
Volume137
DOIs
StatePublished - 15 Dec 2014

Keywords

  • Electromigration
  • Intermetallic compound
  • Metallic composites
  • Phase transformation
  • Solder

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