Fast phase transformation due to electromigration of 18 μm microbumps in three-dimensional integrated-circuit integration

Y. W. Chang; Chih Chen; T. C. Chang; C. J. Zhan; J. Y. Juang; Annie T. Huang

doi:10.1016/j.matlet.2014.08.156

Fast phase transformation due to electromigration of 18 μm microbumps in three-dimensional integrated-circuit integration

Y. W. Chang, Chih Chen^*, T. C. Chang, C. J. Zhan, J. Y. Juang, Annie T. Huang

^*Corresponding author for this work

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

The electromigration behavior was investigated in 18-μm SnAg microbumps at 150 °C. The monitored resistance increase abruptly soon after the current stressing of 4.6×10⁴ A/cm² was applied but the resistance rose much slower after a certain period of time. The formation of the high-resistivity Ni₃Sn₄ intermetallic compounds (IMCs) was responsible for the abrupt resistance increase in the beginning of the current stressing. The whole solder joint was transformed into an IMC joint. Because IMC has a higher electromigration resistance than the solder, a much slower increase in resistance was resulted after the solder joint was transformed into IMCs.

Original language	English
Pages (from-to)	136-138
Number of pages	3
Journal	Materials Letters
Volume	137
DOIs	https://doi.org/10.1016/j.matlet.2014.08.156
State	Published - 15 Dec 2014

Keywords

Electromigration
Intermetallic compound
Metallic composites
Phase transformation
Solder

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title = "Fast phase transformation due to electromigration of 18 μm microbumps in three-dimensional integrated-circuit integration",

abstract = "The electromigration behavior was investigated in 18-μm SnAg microbumps at 150 °C. The monitored resistance increase abruptly soon after the current stressing of 4.6×104 A/cm2 was applied but the resistance rose much slower after a certain period of time. The formation of the high-resistivity Ni3Sn4 intermetallic compounds (IMCs) was responsible for the abrupt resistance increase in the beginning of the current stressing. The whole solder joint was transformed into an IMC joint. Because IMC has a higher electromigration resistance than the solder, a much slower increase in resistance was resulted after the solder joint was transformed into IMCs.",

keywords = "Electromigration, Intermetallic compound, Metallic composites, Phase transformation, Solder",

author = "Chang, {Y. W.} and Chih Chen and Chang, {T. C.} and Zhan, {C. J.} and Juang, {J. Y.} and Huang, {Annie T.}",

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journal = "Materials Letters",

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T1 - Fast phase transformation due to electromigration of 18 μm microbumps in three-dimensional integrated-circuit integration

AU - Chang, Y. W.

AU - Chen, Chih

AU - Chang, T. C.

AU - Zhan, C. J.

AU - Juang, J. Y.

AU - Huang, Annie T.

PY - 2014/12/15

Y1 - 2014/12/15

N2 - The electromigration behavior was investigated in 18-μm SnAg microbumps at 150 °C. The monitored resistance increase abruptly soon after the current stressing of 4.6×104 A/cm2 was applied but the resistance rose much slower after a certain period of time. The formation of the high-resistivity Ni3Sn4 intermetallic compounds (IMCs) was responsible for the abrupt resistance increase in the beginning of the current stressing. The whole solder joint was transformed into an IMC joint. Because IMC has a higher electromigration resistance than the solder, a much slower increase in resistance was resulted after the solder joint was transformed into IMCs.

AB - The electromigration behavior was investigated in 18-μm SnAg microbumps at 150 °C. The monitored resistance increase abruptly soon after the current stressing of 4.6×104 A/cm2 was applied but the resistance rose much slower after a certain period of time. The formation of the high-resistivity Ni3Sn4 intermetallic compounds (IMCs) was responsible for the abrupt resistance increase in the beginning of the current stressing. The whole solder joint was transformed into an IMC joint. Because IMC has a higher electromigration resistance than the solder, a much slower increase in resistance was resulted after the solder joint was transformed into IMCs.

KW - Electromigration

KW - Intermetallic compound

KW - Metallic composites

KW - Phase transformation

KW - Solder

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DO - 10.1016/j.matlet.2014.08.156

M3 - Article

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VL - 137

SP - 136

EP - 138

JO - Materials Letters

JF - Materials Letters

SN - 0167-577X

ER -

Fast phase transformation due to electromigration of 18 μm microbumps in three-dimensional integrated-circuit integration

Abstract

Keywords

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