Fast electrothermally activated micro-positioner using a high-aspect-ratio micro-machined polymeric composite

Gih Keong Lau; Jiaping Yang; Borriboon Thubthimthong; Nyok Boon Chong; Cheng Peng Tan; Zhimin He

doi:10.1063/1.4737644

Fast electrothermally activated micro-positioner using a high-aspect-ratio micro-machined polymeric composite

Gih Keong Lau^*, Jiaping Yang, Borriboon Thubthimthong, Nyok Boon Chong, Cheng Peng Tan, Zhimin He

^*Corresponding author for this work

Department of Mechanical Engineering

Research output: Contribution to journal › Article

9 Scopus citations

Abstract

Recently, silicon electrothermal micro-actuators have been developed for dual-stage micropositioning in hard disk drive. But, silicon with a low coefficient of thermal expansion (CTE) has a shortcoming of requiring a large temperature change (>300 °C) to expand adequately. This letter presented a high-CTE polymer composite to solve the shortcoming of silicon. The polymer composite consists of high-aspect-ratio micro-machined SU-8 thermal expander and silicon thermal conductor. A micro-positioner which embodies the proposed polymer composite can drive a slider to travel fast (>1 kHz) more than a 17 nm-pitch data track under a moderate temperature rise (100 °C).

Original language	English
Article number	033108
Journal	Applied Physics Letters
Volume	101
Issue number	3
DOIs	https://doi.org/10.1063/1.4737644
State	Published - 16 Jul 2012

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Lau, G. K., Yang, J., Thubthimthong, B., Chong, N. B., Tan, C. P., & He, Z. (2012). Fast electrothermally activated micro-positioner using a high-aspect-ratio micro-machined polymeric composite. Applied Physics Letters, 101(3), [033108]. https://doi.org/10.1063/1.4737644

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abstract = "Recently, silicon electrothermal micro-actuators have been developed for dual-stage micropositioning in hard disk drive. But, silicon with a low coefficient of thermal expansion (CTE) has a shortcoming of requiring a large temperature change (>300 °C) to expand adequately. This letter presented a high-CTE polymer composite to solve the shortcoming of silicon. The polymer composite consists of high-aspect-ratio micro-machined SU-8 thermal expander and silicon thermal conductor. A micro-positioner which embodies the proposed polymer composite can drive a slider to travel fast (>1 kHz) more than a 17 nm-pitch data track under a moderate temperature rise (100 °C).",

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