Fabrication of three dimensional Cu metallic photonic crystal by electroless plating

S. C. Wu*, F. J. Hou, P. C. Jang-Jian, M. S. Tsai, M. C. Chen, L. S. Li, Jung Y. Huang, S. Y. Lin

*Corresponding author for this work

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Abstract

A 3D copper (Cu) metallic photonic crystal (MPC) with 180nm line width was fabricated by electroless plating. The mold of 3D MPC for Cu replacement is poly-Si. It has been verified as an enhancing thermal photovoltaic effect while the mold was transferred into tungsten MPC by chemical vapor deposition method. The 5 layers structure of Cu MPC was clear observed with scanning electron microscopy. The photonic band-gap ranged from 1.5 to 13 μm was measured by Fourier transform infrared spectroscopy (FTIR) instrument.

Original languageEnglish
Article number249
Pages (from-to)1261-1265
Number of pages5
JournalJournal of Physics: Conference Series
Volume61
Issue number1
DOIs
StatePublished - 1 Apr 2007

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    Wu, S. C., Hou, F. J., Jang-Jian, P. C., Tsai, M. S., Chen, M. C., Li, L. S., Huang, J. Y., & Lin, S. Y. (2007). Fabrication of three dimensional Cu metallic photonic crystal by electroless plating. Journal of Physics: Conference Series, 61(1), 1261-1265. [249]. https://doi.org/10.1088/1742-6596/61/1/249