Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications

Kuan-Neng Chen*, C. K. Tsang, Wen-Wei Wu, S. H. Lee, J. Q. Lu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Fingerprint Dive into the research topics of 'Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications'. Together they form a unique fingerprint.

Medicine & Life Sciences

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy