Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications

Kuan-Neng Chen*, C. K. Tsang, Wen-Wei Wu, S. H. Lee, J. Q. Lu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

A method to fabricate nano-scale Cu bond pads for improving bonding quality in 3D integration applications is reported. The effect of Cu bonding quality on inter-level via structural reliability for 3D integration applications is investigated. We developed a Cu nano-scale-height bond pad structure and fabrication process for improved bonding quality by recessing oxides using a combination of SiO2 CMP process and dilute HF wet etching. In addition, in order to achieve improved waferlevel bonding, we introduced a seal design concept that prevents corrosion and provides extra mechanical support. Demonstrations of these concepts and processes provide the feasibility of reliable nano-scale 3D integration applications.

Original languageEnglish
Pages (from-to)3336-3339
Number of pages4
JournalJournal of Nanoscience and Nanotechnology
Volume11
Issue number4
DOIs
StatePublished - 1 Dec 2011

Keywords

  • 3D integration
  • Cu
  • Seal
  • Wafer bonding

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