Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications

Kuan-Neng Chen; C. K. Tsang; Wen-Wei Wu; S. H. Lee; J. Q. Lu

doi:10.1166/jnn.2011.3813

Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications

Kuan-Neng Chen^*, C. K. Tsang, Wen-Wei Wu, S. H. Lee, J. Q. Lu

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

A method to fabricate nano-scale Cu bond pads for improving bonding quality in 3D integration applications is reported. The effect of Cu bonding quality on inter-level via structural reliability for 3D integration applications is investigated. We developed a Cu nano-scale-height bond pad structure and fabrication process for improved bonding quality by recessing oxides using a combination of SiO₂ CMP process and dilute HF wet etching. In addition, in order to achieve improved waferlevel bonding, we introduced a seal design concept that prevents corrosion and provides extra mechanical support. Demonstrations of these concepts and processes provide the feasibility of reliable nano-scale 3D integration applications.

Original language	English
Pages (from-to)	3336-3339
Number of pages	4
Journal	Journal of Nanoscience and Nanotechnology
Volume	11
Issue number	4
DOIs	https://doi.org/10.1166/jnn.2011.3813
State	Published - 1 Dec 2011

Keywords

3D integration
Cu
Seal
Wafer bonding

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title = "Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications",

abstract = "A method to fabricate nano-scale Cu bond pads for improving bonding quality in 3D integration applications is reported. The effect of Cu bonding quality on inter-level via structural reliability for 3D integration applications is investigated. We developed a Cu nano-scale-height bond pad structure and fabrication process for improved bonding quality by recessing oxides using a combination of SiO2 CMP process and dilute HF wet etching. In addition, in order to achieve improved waferlevel bonding, we introduced a seal design concept that prevents corrosion and provides extra mechanical support. Demonstrations of these concepts and processes provide the feasibility of reliable nano-scale 3D integration applications.",

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author = "Kuan-Neng Chen and Tsang, {C. K.} and Wen-Wei Wu and Lee, {S. H.} and Lu, {J. Q.}",

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AU - Chen, Kuan-Neng

AU - Tsang, C. K.

AU - Wu, Wen-Wei

AU - Lee, S. H.

AU - Lu, J. Q.

PY - 2011/12/1

Y1 - 2011/12/1

N2 - A method to fabricate nano-scale Cu bond pads for improving bonding quality in 3D integration applications is reported. The effect of Cu bonding quality on inter-level via structural reliability for 3D integration applications is investigated. We developed a Cu nano-scale-height bond pad structure and fabrication process for improved bonding quality by recessing oxides using a combination of SiO2 CMP process and dilute HF wet etching. In addition, in order to achieve improved waferlevel bonding, we introduced a seal design concept that prevents corrosion and provides extra mechanical support. Demonstrations of these concepts and processes provide the feasibility of reliable nano-scale 3D integration applications.

AB - A method to fabricate nano-scale Cu bond pads for improving bonding quality in 3D integration applications is reported. The effect of Cu bonding quality on inter-level via structural reliability for 3D integration applications is investigated. We developed a Cu nano-scale-height bond pad structure and fabrication process for improved bonding quality by recessing oxides using a combination of SiO2 CMP process and dilute HF wet etching. In addition, in order to achieve improved waferlevel bonding, we introduced a seal design concept that prevents corrosion and provides extra mechanical support. Demonstrations of these concepts and processes provide the feasibility of reliable nano-scale 3D integration applications.

KW - 3D integration

KW - Cu

KW - Seal

KW - Wafer bonding

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