Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging

Wei Lan Chiu, Chia Ling Lu, Han Wen Lin, Chien Min Liu, Yi Sa Huang, Tien Lin Lu, Tao Chi Liu, Hsiang Yao Hsiao, Chih Chen, Jui Chao Kuo, King-Ning Tu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Due to the thousands of microbumps on a chip for 3D ICs, the precise control of the microstructure of all the material is required. The nearly <111>-oriented nanotwinned and fine-grained Cu was electroplated on a Si wafer surface and annealed at 400-500 °C for 1 h, many extremely large <100>-oriented Cu crystals with grain sizes ranging from 200 to 400 μm were obtained. The <111>-oriented Cu grains were transformed into super-large <100>-oriented grains after the annealing. In addition, we patterned the <111>-oriented Cu films into pad arrays of 25 to 100 μm in diameter and annealed the nanotwinned Cu pads with same conditions. An array of <100>-oriented single crystals Cu pads can be obtained. Otherwise, single-crystal nano-wire growth displays a process by one-dimensional anisotropic growth, in which the growth along the axial direction is much faster than in the radial direction. This study reported here a bulk-type two-dimensional crystal growth of an array of numerous <100>-oriented single crystals of Cu on Si. The growth process in 3D IC has the potential for microbump applications packaging technology.

Original languageEnglish
Title of host publicationICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages518-522
Number of pages5
ISBN (Electronic)9784904090138
DOIs
StatePublished - 20 May 2015
Event2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
Duration: 14 Apr 201517 Apr 2015

Publication series

NameICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference

Conference

Conference2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
CountryJapan
CityKyoto
Period14/04/1517/04/15

Keywords

  • <100>-oriented Cu
  • abnormal grain growth
  • nanotwinned copper

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