Fine grained and nanotwinned Au has many excellent properties and is widely used in electronic devices. We have fabricated 110 preferred-oriented Au thin films by DC plating at 5 mA/cm(2). Microstructure analysis of the films show a unique fine grain structure with a twin formation. Hardness tests performed on electroplated 110 Au films show a hardness 47% greater than random and untwinned Au. We then achieved direct bonding between two Au 110 surfaces operating at 200 degrees C for an hour in a vacuum oven. The highly-oriented 110 nanotwinned Au films could be an ideal material in many gold products.