Extremely rapid grain growth in scallop-type Cu6Sn5 during solid–liquid interdiffusion reactions in micro-bump solder joints

A. M. Gusak, King-Ning Tu, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

In 3D IC technology, when the size of the micro-bump solder joint is reduced to 10 µm, the scallop-type Cu6Sn5 grains on opposite sides of the joint can interact directly by contacting each other during the solid–liquid interdiffusion reaction. Upon contact, an extremely rapid grain growth of the scallops occurs. We propose that the liquid solder wets the grain boundary between scallops and provides an extremely fast kinetic path of liquid channel for grain growth. The width of the liquid channel has been estimated to be about 1.5 nm. This is a unique phenomenon observed in micro-bump solid joints.

Original languageEnglish
Pages (from-to)45-48
Number of pages4
JournalScripta Materialia
Volume179
DOIs
StatePublished - 1 Apr 2020

Keywords

  • Grain growth
  • Liquid channel
  • Micro-bump
  • Scallop of CuSn
  • Solder joint technology

Fingerprint Dive into the research topics of 'Extremely rapid grain growth in scallop-type Cu<sub>6</sub>Sn<sub>5</sub> during solid–liquid interdiffusion reactions in micro-bump solder joints'. Together they form a unique fingerprint.

  • Cite this