Experimental investigation of high performance thermal module with dimple vortex generators

Kai Shing Yang*, Kuo Liang Wun, Ing Youn Chen, Chi-Chuan Wang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Pressure drop and heat transfer characteristics of different dimple vortex generators arrangement are examined in this study. A total of five heat sinks were made and tested, including plain fin, dimple, two-group dimple, oblique dimple gap 4-12 fin, oblique dimple gap 6-12 fin. The tested results indicate that the pressure drop for dimple fin geometry is significantly higher than other fin types, followed by the two group dimple fin. The fin structure with oblique dimple shows slightly increase of pressure drop as compared to the plain fin surface. The results show that more complicated fin structure will lead to higher pressure drop. The observed IR image of the temperature measurement of the test fin configurations also proves the measurements. The results suggest that the fin with dimple vortex generators is more beneficial than that of plain fin geometry. The oblique dimple fin is especially useful for air-cooling applicable for electronic devices to achieve effective augmentations without suffering from significant pressure penalty.

Original languageEnglish
Title of host publicationInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
StatePublished - 1 Dec 2010
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
Duration: 20 Oct 201022 Oct 2010

Publication series

NameInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Conference

Conference2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
CountryTaiwan
CityTaipei
Period20/10/1022/10/10

Keywords

  • Dimple
  • Fin
  • Vortex generator

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