Evolution of the Sn/Ni-8.0 at.%V interfacial reaction paths

Sinn Wen Chen; Yu Ren Lin; Hsin-Jay Wu; Ru Bo Chang; Chia Ming Hsu; Hong Ming Lin

doi:10.1557/jmr.2011.297

Evolution of the Sn/Ni-8.0 at.%V interfacial reaction paths

Sinn Wen Chen^*, Yu Ren Lin, Hsin-Jay Wu, Ru Bo Chang, Chia Ming Hsu, Hong Ming Lin

^*Corresponding author for this work

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

Sn/Ni-8.0 at.%V (Ni-7.0 wt%V) couples are prepared and the interfacial reactions at 210 and 250°C are examined. In the early stage of reaction at 250°C, a T phase is formed as a result of fast diffusion of Sn into the Ni-8.0 at.%V substrate. With a longer reaction, the outer region of the T phase transforms to a Ni-depletion layer, which has not been observed previously. Both the T phase and the Ni-depletion layer are analyzed using transmission electronic microscopy. This newly found Ni-depletion layer is composed of Sn and nanosize "VSn2(V₂Sn₃)" particulates. The solid/solid reaction paths in the Sn/Ni-8.0 at.%V couples evolve from Sn/T/Ni-V, Sn/Ni₃Sn₄/T/Ni-V to Sn/Ni₃Sn ₄/VSn₂(V₂Sn₃). During the liquid/solid reactions, the paths are liquid/T/Ni-V, liquid/liquid + Ni3Sn4/T/Ni-V, liquid/liquid + Ni3Sn4/liquid + VSn2(V₂Sn ₃)/T/Ni-V, and liquid/liquid + Ni3Sn4/liquid + VSn2(V ₂Sn₃).

Original language	English
Pages (from-to)	2838-2843
Number of pages	6
Journal	Journal of Materials Research
Volume	26
Issue number	22
DOIs	https://doi.org/10.1557/jmr.2011.297
State	Published - 28 Nov 2011

Keywords

Amorphous
Microstructure
Soldering

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title = "Evolution of the Sn/Ni-8.0 at.%V interfacial reaction paths",

abstract = "Sn/Ni-8.0 at.%V (Ni-7.0 wt%V) couples are prepared and the interfacial reactions at 210 and 250°C are examined. In the early stage of reaction at 250°C, a T phase is formed as a result of fast diffusion of Sn into the Ni-8.0 at.%V substrate. With a longer reaction, the outer region of the T phase transforms to a Ni-depletion layer, which has not been observed previously. Both the T phase and the Ni-depletion layer are analyzed using transmission electronic microscopy. This newly found Ni-depletion layer is composed of Sn and nanosize {"}VSn2(V2Sn3){"} particulates. The solid/solid reaction paths in the Sn/Ni-8.0 at.%V couples evolve from Sn/T/Ni-V, Sn/Ni3Sn4/T/Ni-V to Sn/Ni3Sn 4/VSn2(V2Sn3). During the liquid/solid reactions, the paths are liquid/T/Ni-V, liquid/liquid + Ni3Sn4/T/Ni-V, liquid/liquid + Ni3Sn4/liquid + VSn2(V2Sn 3)/T/Ni-V, and liquid/liquid + Ni3Sn4/liquid + VSn2(V 2Sn3).",

keywords = "Amorphous, Microstructure, Soldering",

author = "Chen, {Sinn Wen} and Lin, {Yu Ren} and Hsin-Jay Wu and Chang, {Ru Bo} and Hsu, {Chia Ming} and Lin, {Hong Ming}",

year = "2011",

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doi = "10.1557/jmr.2011.297",

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AU - Chen, Sinn Wen

AU - Lin, Yu Ren

AU - Wu, Hsin-Jay

AU - Chang, Ru Bo

AU - Hsu, Chia Ming

AU - Lin, Hong Ming

PY - 2011/11/28

Y1 - 2011/11/28

N2 - Sn/Ni-8.0 at.%V (Ni-7.0 wt%V) couples are prepared and the interfacial reactions at 210 and 250°C are examined. In the early stage of reaction at 250°C, a T phase is formed as a result of fast diffusion of Sn into the Ni-8.0 at.%V substrate. With a longer reaction, the outer region of the T phase transforms to a Ni-depletion layer, which has not been observed previously. Both the T phase and the Ni-depletion layer are analyzed using transmission electronic microscopy. This newly found Ni-depletion layer is composed of Sn and nanosize "VSn2(V2Sn3)" particulates. The solid/solid reaction paths in the Sn/Ni-8.0 at.%V couples evolve from Sn/T/Ni-V, Sn/Ni3Sn4/T/Ni-V to Sn/Ni3Sn 4/VSn2(V2Sn3). During the liquid/solid reactions, the paths are liquid/T/Ni-V, liquid/liquid + Ni3Sn4/T/Ni-V, liquid/liquid + Ni3Sn4/liquid + VSn2(V2Sn 3)/T/Ni-V, and liquid/liquid + Ni3Sn4/liquid + VSn2(V 2Sn3).

AB - Sn/Ni-8.0 at.%V (Ni-7.0 wt%V) couples are prepared and the interfacial reactions at 210 and 250°C are examined. In the early stage of reaction at 250°C, a T phase is formed as a result of fast diffusion of Sn into the Ni-8.0 at.%V substrate. With a longer reaction, the outer region of the T phase transforms to a Ni-depletion layer, which has not been observed previously. Both the T phase and the Ni-depletion layer are analyzed using transmission electronic microscopy. This newly found Ni-depletion layer is composed of Sn and nanosize "VSn2(V2Sn3)" particulates. The solid/solid reaction paths in the Sn/Ni-8.0 at.%V couples evolve from Sn/T/Ni-V, Sn/Ni3Sn4/T/Ni-V to Sn/Ni3Sn 4/VSn2(V2Sn3). During the liquid/solid reactions, the paths are liquid/T/Ni-V, liquid/liquid + Ni3Sn4/T/Ni-V, liquid/liquid + Ni3Sn4/liquid + VSn2(V2Sn 3)/T/Ni-V, and liquid/liquid + Ni3Sn4/liquid + VSn2(V 2Sn3).

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KW - Microstructure

KW - Soldering

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JO - Journal of Materials Research

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Evolution of the Sn/Ni-8.0 at.%V interfacial reaction paths

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