Evaluation of ultra-low specific contact resistance extraction by cross-bridge Kelvin resistor structure and transmission line method structure

Bing-Yue Tsui, Hsuan Tzu Tseng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

This work evaluates the accuracy of the specific contact resistance extraction by the cross-bridge Kelvin resistor (CBKR) structure and the self-aligned transmission line method (mTLM) structure considering three-dimensional effect. The mTLM structure is more accurate than the CBKR structure in theory but more sensitive to process variation. The sensitivity to process variation could be suppressed by averaging large amount data. Nevertheless, the recessed contact interface would underestimate the true specific contact resistance and would cause complicated extraction problem for both test structures as the contact resistivity becomes less than 10 -8 ohm-cm2.

Original languageEnglish
Title of host publication2014 IEEE International Conference on Microelectronic Test Structures, ICMTS 2014 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages58-63
Number of pages6
ISBN (Print)9781479921928
DOIs
StatePublished - 1 Jan 2014
Event27th International Conference on Microelectronic Test Structures, ICMTS 2014 - Udine, Italy
Duration: 24 Mar 201427 Mar 2014

Publication series

NameIEEE International Conference on Microelectronic Test Structures

Conference

Conference27th International Conference on Microelectronic Test Structures, ICMTS 2014
CountryItaly
CityUdine
Period24/03/1427/03/14

Keywords

  • Contact resistivity
  • Cross-bridge Kelvin resistor
  • Specific contact resistance
  • Transmission line method

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    Tsui, B-Y., & Tseng, H. T. (2014). Evaluation of ultra-low specific contact resistance extraction by cross-bridge Kelvin resistor structure and transmission line method structure. In 2014 IEEE International Conference on Microelectronic Test Structures, ICMTS 2014 - Conference Proceedings (pp. 58-63). [6841468] (IEEE International Conference on Microelectronic Test Structures). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICMTS.2014.6841468