Evaluation of low dielectric constant materials for on-chip interconnects - an industry/university research collaboration

Leu-Jih Perng*, Steve Holland, Kenneth A. Monnig, Paul S. Ho

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

Abstract

This paper describes the collaboration between university and industry in the evaluation of low dielectric materials for on-chip interconnect applications. The collaboration has established selection criteria and characterization methodologies for materials evaluation of dielectric thin films in the micron range. A review on the concerted efforts of semiconductor industry, materials suppliers, university and consortium in materials and processing evaluation and in improving the ILD materials in alignment of SIA Technology Roadmap will be described. The characterization techniques of thin films and results of materials evaluation will be discussed.

Original languageEnglish
Pages (from-to)122-125
Number of pages4
JournalBiennial University/Government/Industry Microelectronics Symposium - Proceedings
StatePublished - 1 Jan 1995
EventIEE Electronics Division Colloquium on Multiresolution Modelling and Analysis in Image Processing and Computer Vision - London, UK
Duration: 21 Apr 199421 Apr 1994

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