This paper describes the collaboration between university and industry in the evaluation of low dielectric materials for on-chip interconnect applications. The collaboration has established selection criteria and characterization methodologies for materials evaluation of dielectric thin films in the micron range. A review on the concerted efforts of semiconductor industry, materials suppliers, university and consortium in materials and processing evaluation and in improving the ILD materials in alignment of SIA Technology Roadmap will be described. The characterization techniques of thin films and results of materials evaluation will be discussed.
|Number of pages||4|
|Journal||Biennial University/Government/Industry Microelectronics Symposium - Proceedings|
|State||Published - 1 Jan 1995|
|Event||IEE Electronics Division Colloquium on Multiresolution Modelling and Analysis in Image Processing and Computer Vision - London, UK|
Duration: 21 Apr 1994 → 21 Apr 1994