Erratum: A study of encapsulation resin containing hexagonal boron nitride (hBN) as inorganic filler (Journal of Inorganic and Organometallic Polymers and Materials DOI: 10.1007/s10904-006-9037-8)

Tzu Hsuan Chiang, Tsung-Eong Hsien*

*Corresponding author for this work

Research output: Contribution to journalComment/debate

1 Scopus citations
Original languageEnglish
Number of pages1
JournalJournal of Inorganic and Organometallic Polymers and Materials
Volume17
Issue number1
DOIs
StatePublished - 1 Mar 2007

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