Erratum: 3D-printed microelectronics for integrated circuitry and passive wireless sensors (Microsystems & Nanoengineering, (2015), 1, 15013, 10.1038/micronano.2015.13)

Sung Yueh Wu, Chen Yang, Wen-Syang Hsu, Liwei Lin

Research output: Contribution to journalComment/debate

6 Scopus citations

Abstract

Microsystems & Nanoengineering (2015) 1, 15013; doi: 10.1038/micronano.2015.13; Published online: 20 July 2015 Since the publication of this article, the authors would like to make two corrections in the third(last) paragraph of “Design and Fabrication” section as follows: 1 Replace “fused deposition modeling technology” with “multi-jet modeling (MJM)”; 2 The company information of “ProJet HD 3000 printer, Hewlett-Packard Company, Palo Alto, CA, USA” should be replaced with “ProJet HD 3000 printer, 3D Systems Inc., Rock Hill, SC, USA”. We apologize for any inconvenience may have caused.

Original languageEnglish
Article number15036
JournalMicrosystems and Nanoengineering
Volume1
DOIs
StatePublished - 1 Jan 2015

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