Equivalent circuit of a through via in multi-layer environment

Kwei K. Chang, Chien Nan Kuo, Tzong Lin Wu, Wei Lin Chen, Ruey Beei Wu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations
Original languageEnglish
Title of host publicationElectrical Performance of Electronic Packaging, EPEP 1992
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages59-61
Number of pages3
ISBN (Electronic)078030683X, 9780780306837
DOIs
StatePublished - 1 Jan 1992
Event1992 Electrical Performance of Electronic Packaging, EPEP 1992 - Tucson, United States
Duration: 22 Apr 199224 Apr 1992

Publication series

NameElectrical Performance of Electronic Packaging, EPEP 1992

Conference

Conference1992 Electrical Performance of Electronic Packaging, EPEP 1992
CountryUnited States
CityTucson
Period22/04/9224/04/92

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