Equivalent circuit of a through via in multi-layer environment

Kwei K. Chang; Chien Nan Kuo; Tzong Lin Wu; Wei Lin Chen; Ruey Beei Wu

doi:10.1109/EPEP.1992.572265

Equivalent circuit of a through via in multi-layer environment

Kwei K. Chang, Chien Nan Kuo, Tzong Lin Wu, Wei Lin Chen, Ruey Beei Wu

Department of Electronics Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Original language	English
Title of host publication	Electrical Performance of Electronic Packaging, EPEP 1992
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	59-61
Number of pages	3
ISBN (Electronic)	078030683X, 9780780306837
DOIs	https://doi.org/10.1109/EPEP.1992.572265
State	Published - 1 Jan 1992
Event	1992 Electrical Performance of Electronic Packaging, EPEP 1992 - Tucson, United States Duration: 22 Apr 1992 → 24 Apr 1992

Publication series

Name	Electrical Performance of Electronic Packaging, EPEP 1992

Conference

Conference	1992 Electrical Performance of Electronic Packaging, EPEP 1992
Country	United States
City	Tucson
Period	22/04/92 → 24/04/92

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10.1109/EPEP.1992.572265

Cite this

Chang, K. K., Kuo, C. N., Wu, T. L., Chen, W. L., & Wu, R. B. (1992). Equivalent circuit of a through via in multi-layer environment. In Electrical Performance of Electronic Packaging, EPEP 1992 (pp. 59-61). [572265] (Electrical Performance of Electronic Packaging, EPEP 1992). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.1992.572265

@inproceedings{cba766f7fd1d4295abcc381a4806672b,

title = "Equivalent circuit of a through via in multi-layer environment",

author = "Chang, {Kwei K.} and Kuo, {Chien Nan} and Wu, {Tzong Lin} and Chen, {Wei Lin} and Wu, {Ruey Beei}",

year = "1992",

month = jan,

day = "1",

doi = "10.1109/EPEP.1992.572265",

language = "English",

series = "Electrical Performance of Electronic Packaging, EPEP 1992",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "59--61",

booktitle = "Electrical Performance of Electronic Packaging, EPEP 1992",

address = "United States",

note = "null ; Conference date: 22-04-1992 Through 24-04-1992",

}

Chang, KK, Kuo, CN, Wu, TL, Chen, WL & Wu, RB 1992, Equivalent circuit of a through via in multi-layer environment. in Electrical Performance of Electronic Packaging, EPEP 1992., 572265, Electrical Performance of Electronic Packaging, EPEP 1992, Institute of Electrical and Electronics Engineers Inc., pp. 59-61, 1992 Electrical Performance of Electronic Packaging, EPEP 1992, Tucson, United States, 22/04/92. https://doi.org/10.1109/EPEP.1992.572265

Equivalent circuit of a through via in multi-layer environment. / Chang, Kwei K.; Kuo, Chien Nan; Wu, Tzong Lin; Chen, Wei Lin; Wu, Ruey Beei.

Electrical Performance of Electronic Packaging, EPEP 1992. Institute of Electrical and Electronics Engineers Inc., 1992. p. 59-61 572265 (Electrical Performance of Electronic Packaging, EPEP 1992).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Equivalent circuit of a through via in multi-layer environment

AU - Chang, Kwei K.

AU - Kuo, Chien Nan

AU - Wu, Tzong Lin

AU - Chen, Wei Lin

AU - Wu, Ruey Beei

PY - 1992/1/1

Y1 - 1992/1/1

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U2 - 10.1109/EPEP.1992.572265

DO - 10.1109/EPEP.1992.572265

M3 - Conference contribution

AN - SCOPUS:77952745589

T3 - Electrical Performance of Electronic Packaging, EPEP 1992

SP - 59

EP - 61

BT - Electrical Performance of Electronic Packaging, EPEP 1992

PB - Institute of Electrical and Electronics Engineers Inc.

Y2 - 22 April 1992 through 24 April 1992

ER -

Equivalent circuit of a through via in multi-layer environment

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