Enhancement on the bonding strength of Cu-Cu joints by 2 steps annealing

Jia Juen Ong, K. N. Tu, Chih Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

We investigate the contribution of shear strength by the bonding temperature and shear strength in highly <111> nano-twinned copper. The bonding process is implemented in two steps. The first step is to alight top die and bottom die by using the alignment marks in nitrogen ambient under thermal compression within 30 seconds and 10 seconds. Second step is to anneal the chips in argon ambient that in argon ambient by previous step. To analyze the positive effect of post annealing in the process, we apply shear test and four probes measurement to get the qualitative result in strength and electrical properties.

Original languageEnglish
Title of host publicationInternational Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings
PublisherIEEE Computer Society
Pages79-81
Number of pages3
ISBN (Electronic)9781728198514
DOIs
StatePublished - 21 Oct 2020
Event15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Taipei, Taiwan
Duration: 21 Oct 202023 Oct 2020

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2020-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020
CountryTaiwan
CityTaipei
Period21/10/2023/10/20

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