Enhancement of flip-chip light-emitting diodes with omni-directional reflector and textured micropillar arrays

Chia En Lee; Yi Jiun Lee; Hao-Chung Kuo; Meng Ru Tsai; B. S. Cheng; Tien-chang Lu; Shing Chung Wang; Chia Tai Kuo

doi:10.1109/LPT.2007.901718

Enhancement of flip-chip light-emitting diodes with omni-directional reflector and textured micropillar arrays

Chia En Lee^*, Yi Jiun Lee, Hao-Chung Kuo, Meng Ru Tsai, B. S. Cheng, Tien-chang Lu, Shing Chung Wang, Chia Tai Kuo

^*Corresponding author for this work

Department of Photonics

Research output: Contribution to journal › Article › peer-review

24 Scopus citations

Abstract

The flip-chip light-emitting diodes (FC-LEDs) with a conductive omni-directional reflector and textured micropillar arrays were investigated. The micropillar arrays structure was formed on the bottom side of sapphire substrate by dry etching process to increase the light-extraction efficiency. The light output power of the FC-LED was increased by 65% for a 3.2-μm textured micropillar on the bottom side of the sapphire substrate. Our work offers promising potential for enhancing output powers of commercial light-emitting devices.

Original language	English
Article number	4273566
Pages (from-to)	1200-1202
Number of pages	3
Journal	IEEE Photonics Technology Letters
Volume	19
Issue number	16
DOIs	https://doi.org/10.1109/LPT.2007.901718
State	Published - 15 Aug 2007

Keywords

Dry etching
Flip-chip light-emitting diodes (FC-LEDs)
Micropillar-array
Omni-directional reflectors (ODRs)

Access to Document

10.1109/LPT.2007.901718

Fingerprint Dive into the research topics of 'Enhancement of flip-chip light-emitting diodes with omni-directional reflector and textured micropillar arrays'. Together they form a unique fingerprint.

Cite this

@article{8587fb9704e74e76866f1161627bc30a,

title = "Enhancement of flip-chip light-emitting diodes with omni-directional reflector and textured micropillar arrays",

abstract = "The flip-chip light-emitting diodes (FC-LEDs) with a conductive omni-directional reflector and textured micropillar arrays were investigated. The micropillar arrays structure was formed on the bottom side of sapphire substrate by dry etching process to increase the light-extraction efficiency. The light output power of the FC-LED was increased by 65% for a 3.2-μm textured micropillar on the bottom side of the sapphire substrate. Our work offers promising potential for enhancing output powers of commercial light-emitting devices.",

keywords = "Dry etching, Flip-chip light-emitting diodes (FC-LEDs), Micropillar-array, Omni-directional reflectors (ODRs)",

author = "Lee, {Chia En} and Lee, {Yi Jiun} and Hao-Chung Kuo and Tsai, {Meng Ru} and Cheng, {B. S.} and Tien-chang Lu and Wang, {Shing Chung} and Kuo, {Chia Tai}",

year = "2007",

month = aug,

day = "15",

doi = "10.1109/LPT.2007.901718",

language = "English",

volume = "19",

pages = "1200--1202",

journal = "IEEE Photonics Technology Letters",

issn = "1041-1135",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "16",

}

Enhancement of flip-chip light-emitting diodes with omni-directional reflector and textured micropillar arrays. / Lee, Chia En; Lee, Yi Jiun; Kuo, Hao-Chung; Tsai, Meng Ru; Cheng, B. S.; Lu, Tien-chang; Wang, Shing Chung; Kuo, Chia Tai.

In: IEEE Photonics Technology Letters, Vol. 19, No. 16, 4273566, 15.08.2007, p. 1200-1202.

Research output: Contribution to journal › Article › peer-review

TY - JOUR

T1 - Enhancement of flip-chip light-emitting diodes with omni-directional reflector and textured micropillar arrays

AU - Lee, Chia En

AU - Lee, Yi Jiun

AU - Kuo, Hao-Chung

AU - Tsai, Meng Ru

AU - Cheng, B. S.

AU - Lu, Tien-chang

AU - Wang, Shing Chung

AU - Kuo, Chia Tai

PY - 2007/8/15

Y1 - 2007/8/15

N2 - The flip-chip light-emitting diodes (FC-LEDs) with a conductive omni-directional reflector and textured micropillar arrays were investigated. The micropillar arrays structure was formed on the bottom side of sapphire substrate by dry etching process to increase the light-extraction efficiency. The light output power of the FC-LED was increased by 65% for a 3.2-μm textured micropillar on the bottom side of the sapphire substrate. Our work offers promising potential for enhancing output powers of commercial light-emitting devices.

AB - The flip-chip light-emitting diodes (FC-LEDs) with a conductive omni-directional reflector and textured micropillar arrays were investigated. The micropillar arrays structure was formed on the bottom side of sapphire substrate by dry etching process to increase the light-extraction efficiency. The light output power of the FC-LED was increased by 65% for a 3.2-μm textured micropillar on the bottom side of the sapphire substrate. Our work offers promising potential for enhancing output powers of commercial light-emitting devices.

KW - Dry etching

KW - Flip-chip light-emitting diodes (FC-LEDs)

KW - Micropillar-array

KW - Omni-directional reflectors (ODRs)

UR - http://www.scopus.com/inward/record.url?scp=34547602314&partnerID=8YFLogxK

U2 - 10.1109/LPT.2007.901718

DO - 10.1109/LPT.2007.901718

M3 - Article

AN - SCOPUS:34547602314

VL - 19

SP - 1200

EP - 1202

JO - IEEE Photonics Technology Letters

JF - IEEE Photonics Technology Letters

SN - 1041-1135

IS - 16

M1 - 4273566

ER -

Enhancement of flip-chip light-emitting diodes with omni-directional reflector and textured micropillar arrays

Abstract

Keywords

Access to Document

Other files and links

Cite this