Enhancement of flip-chip light-emitting diodes with omni-directional reflector and textured micropillar arrays

Chia En Lee*, Yi Jiun Lee, Hao-Chung Kuo, Meng Ru Tsai, B. S. Cheng, Tien-chang Lu, Shing Chung Wang, Chia Tai Kuo

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

24 Scopus citations

Abstract

The flip-chip light-emitting diodes (FC-LEDs) with a conductive omni-directional reflector and textured micropillar arrays were investigated. The micropillar arrays structure was formed on the bottom side of sapphire substrate by dry etching process to increase the light-extraction efficiency. The light output power of the FC-LED was increased by 65% for a 3.2-μm textured micropillar on the bottom side of the sapphire substrate. Our work offers promising potential for enhancing output powers of commercial light-emitting devices.

Original languageEnglish
Article number4273566
Pages (from-to)1200-1202
Number of pages3
JournalIEEE Photonics Technology Letters
Volume19
Issue number16
DOIs
StatePublished - 15 Aug 2007

Keywords

  • Dry etching
  • Flip-chip light-emitting diodes (FC-LEDs)
  • Micropillar-array
  • Omni-directional reflectors (ODRs)

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