Enhancement of CMOS THz imaging sensing by packaging technology

Chien-Nan Kuo, Wei Cheng Chen, Te Yen Chiu, Chun Hsing Li

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Terahertz imaging sensing provides numerous attractive applications in different areas, for example, biology and medicine. CMOS technology benefits an imaging system in low cost and a small form factor. The technology advance is technically viable for circuit design in such high frequencies. Lossy silicon substrate, however, still degrades system performance. We will discuss the techniques of performance enhancement.

Original languageEnglish
Title of host publication2017 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages22-24
Number of pages3
ISBN (Electronic)9781509040360
DOIs
StatePublished - 20 Sep 2017
Event2017 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2017 - Seoul, Korea, Republic of
Duration: 30 Aug 20171 Sep 2017

Publication series

Name2017 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2017

Conference

Conference2017 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2017
CountryKorea, Republic of
CitySeoul
Period30/08/171/09/17

Keywords

  • 3D
  • CMOS
  • THz
  • dielectric resonator
  • imaging system
  • switch

Fingerprint Dive into the research topics of 'Enhancement of CMOS THz imaging sensing by packaging technology'. Together they form a unique fingerprint.

Cite this