In this letter, we propose a new method to improve resistive switching properties in ZrO2-based conductive-bridge resistive memory devices by introducing a thin AlN layer with high thermal conductivity between the ZrO2 layer and TiN bottom electrode. Compared with the Cu/TiW/ZrO2/TiN single-layer device, the Cu/TiW/ZrO2/AlN/TiN bilayer device exhibits lower operation voltages, higher endurance performance, and higher resistive switching uniformity. These substantial improvements in the resistive switching properties are attributed to the formation and rupture of conductive filament that can be effectively controlled in the device after inserting the AlN layer.
- conductive filament (CF)
- conductive-bridge random access memory (CBRAM)
- Thermal conductivity