A p-side-up GaN-based light-emitting diode (LED) on a silicon substrate was designed and fabricated using a combination of omnidirectional reflector (ODR) and double-side textured surface (both p-GaN and undoped-GaN) structures via surfaceroughening, laser lift-off (LLO) and wafer-bonding technologies. The reflectivity of the designed ODR can reach 99.1% at a wavelength of 460 nm. The textured surface of top p-GaN was achieved under low temperature (LT) conditions using metalorganic chemical vapor deposition. It was found that the GaN LED with an extra 200-nm-thick LT p-GaN layer exhibits a 50% enhancement in luminance intensity. The luminance efficiency of double-side roughened silicon-ODR-GaN LED with a small chip size of 250 μm x 500 μm can be improved from 23.2% to 28.2% at an injection current of 20 mA. For the case of 1 mm X 1 mm in chip size, the saturation behavior of the light output power is not observed when an injection current increased from 20 to 350 mA, where the luminance efficiency at 20 mA can reach 28.9%, demonstrating an enhancement by 46 %, as compared with that of the conventional GaN-sapphire LEDs. These enhanced results can be attributed to higher reflectivity from the ODR and multiple chances of light emitted from the active region to escape, as well as a centralizing effect of light along the vertical direction.
- Double-side roughening
- Laser lift-off (LLO)
- Light-emitting diode (LED)
- Omnidirectional reflector (ODR)
- Wafer bonding