Enhanced flow boiling in manifold microchannels through integrating three-dimensional flow and hierarchical surface

Sheng Wang, Hsiu Hung Chen, Chung-Lung Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A compact silicon based manifold microchannel heat sink with embedded SiNWs was designed and fabricated in order to enhance heat transfer and reduce flow instability during two phase flow boiling. The manifold microchannel device comprises parallel longitudinal microchannels etched in a silicon substrate and transverse microchannels etched on a glass cover. Flow boiling characteristics with deionized water in such SiNWs embedded manifold microchannels were investigated. Experimental results of the SiNWs embedded device show good improvements in heat transfer performance and reduced pressure loss compared with the plain wall device. The effects of mass flux and subcooled inlet temperature were studied, and a maximum heat flux of about 431 W/cm2 has been achieved by employing different experimental conditions while confined by the capability of heating elements. Wall temperature fluctuation and flow pattern results present the effective flow instability control and dry out prevention with the capillary driven three-dimensional flow.

Original languageEnglish
Title of host publication47th AIAA Fluid Dynamics Conference, 2017
PublisherAmerican Institute of Aeronautics and Astronautics Inc, AIAA
ISBN (Print)9781624105005
StatePublished - 1 Jan 2017
Event47th AIAA Fluid Dynamics Conference, 2017 - Denver, United States
Duration: 5 Jun 20179 Jun 2017

Publication series

Name47th AIAA Fluid Dynamics Conference, 2017

Conference

Conference47th AIAA Fluid Dynamics Conference, 2017
CountryUnited States
CityDenver
Period5/06/179/06/17

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