Elimination of Au-embrittlement in solder joints on Au/Ni metallization

M. O. Alam, Y. C. Chan*, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticle

55 Scopus citations


Systematic experimental work was carried out to understand the mechanism of Au diffusion to the solder interface, and a novel method was proposed to eliminate Au embrittlement by circumventing the continuous layer of (Au,Ni)Sn4 at the solder interface. Contrary to the usual expectation, it was determined that utilization of a very thin Ni metallization in the Au/Ni/Cu under bump metallization (UBM) was an effective means of maintaining mechanical integrity of the solder joint. It was found that the out-diffusion of Cu during the aging period changes the chemistry and morphology of the intermetallic compounds at the interface.

Original languageEnglish
Pages (from-to)1303-1306
Number of pages4
JournalJournal of Materials Research
Issue number5
StatePublished - 1 May 2004

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