Electronic THz transmissive imaging system

Wei Cheng Chen, Chih Wei Lai, Tzu Chao Yan, Chun Hsing Li, Tzu Yuan Chao, Chien-Nan Kuo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An electronic THz transmissive imaging system is presented in this work. This system is composed of a CMOS signal source, a CMOS signal sensor, lenses, and commercial electronic chopping components. The output frequency of the signal source is 339 GHz, and the responsivity of the signal sensor is 200 kV/W. The total dc power consumption of those CMOS circuits is 91.02 mW. Using electronic chopping at the frequency up to 100 kHz helps improve the system dynamic range and makes imaging feasible. The resolution of the realized imaging system achieves 2 mm.

Original languageEnglish
Title of host publication2015 IEEE 15th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages21-23
Number of pages3
ISBN (Electronic)9781479981960
DOIs
StatePublished - 8 Jun 2015
Event2015 15th IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2015 - San Diego, United States
Duration: 26 Jan 201528 Jan 2015

Publication series

Name2015 IEEE 15th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2015

Conference

Conference2015 15th IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2015
CountryUnited States
CitySan Diego
Period26/01/1528/01/15

Keywords

  • chopping
  • lens
  • THz imaging
  • THz sensor
  • THz source

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  • Cite this

    Chen, W. C., Lai, C. W., Yan, T. C., Li, C. H., Chao, T. Y., & Kuo, C-N. (2015). Electronic THz transmissive imaging system. In 2015 IEEE 15th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2015 (pp. 21-23). [7119862] (2015 IEEE 15th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SIRF.2015.7119862