Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates

C. K. Lin, Chih Chen, H. M. Yu, J. K. Lan, D. L. Lee

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This study investigates electromigration study of eutectic SnPb flip-ch.ip .solder joints on ceramic substrates. The under bump metalltzatlon (UBM) structure consists of 5-J.lIll Cu / 3-J.lIll Ni under bump metallization (UBM). Under the current stressing by 0.9A at 150°C, we did not find void formation but a large amount of intermetallic compound (IMC) ofCU 6 (Sn,Ni) 5 were formed when the bump resistance increased 10 mΩ. Three-dimensional electrical simulation by finite element analysis was carried out to simulate the current density distribution in solder joints with slit Cu traces. It is found that the current density was almost uniformly distributed in solder joint for this structure. It is found that the bump resistance only increases 0.07mΩ when half of the solder bump was transformed into CU 6 Sn 5 IMC. The reason for the low crowding effect In the solder joints will be discussed in the conference.

Original languageEnglish
Title of host publication2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Pages259-261
Number of pages3
DOIs
StatePublished - 1 Dec 2008
Event2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 - Taipei, Taiwan
Duration: 22 Oct 200824 Oct 2008

Publication series

Name2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Conference

Conference2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
CountryTaiwan
CityTaipei
Period22/10/0824/10/08

Fingerprint Dive into the research topics of 'Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates'. Together they form a unique fingerprint.

Cite this